Hybrid Bonding, Advanced Substr...
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Chiplet Design and Heterogeneou...
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Published 28 Mar 2023- $223.82
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Handbook of Tape Automated Bond...
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Published 31 Jan 1992- $251.53
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Solder Joint Reliability
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Published 23 Feb 2014Save $2.16
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Chip on Board Technologies for ...
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Published 30 Jun 1994Save $2.16
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Through-Silicon Vias for 3D Int...
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Reliability of RoHS-Compliant 2...
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Published 16 Dec 2010Save $2.10
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Solder Joint Reliability
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Published 31 May 1991- $251.53
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3D IC Integration and Packaging
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Published 16 Oct 2015- $281.47
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Chiplet Design and Heterogeneou...
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Published 29 Mar 2024- $162.85
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Flip Chip, Hybrid Bonding, Fan-...
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Fan-Out Wafer-Level Packaging
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Fan-Out Wafer-Level Packaging
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Heterogeneous Integrations
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Semiconductor Advanced Packaging
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Semiconductor Advanced Packaging
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Chiplet Design and Heterogeneou...
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Assembly and Reliability of Lea...
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Assembly and Reliability of Lea...
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Thermal Stress and Strain in Mi...
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Published 05 Aug 1993 -
Handbook of Fine Pitch Surface ...
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Published 30 Nov 1993 -
Low Cost Flip Chip Technologies
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Published 01 Mar 2000 -
Flip Chip Technologies
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Electronics Manufacturing With ...
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Advanced MEMS Packaging
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Ball Grid Array Technology
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Solder Joint Reliability of BGA...
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Published 01 Dec 1996 -
Microvias
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Chip Scale Package (CSP)
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Electronic Packaging
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Thirteenth IEEE/CHMT Internatio...
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Published 01 Jan 1992 -
Heterogeneous Integrations
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Heterogeneous Integrations
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Streitfall Evolution
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Published 16 Oct 2017